Product

Description

Intended Use

FR?

Cure
°F (°C)

Operating
°F (°C)

Notes

Modified Epoxy

General Purpose Bonding

N

Y

235-275
(113-135)

-65-180
(-54-82)

No Volatiles
Metal-Metal Bonding

Modified Epoxy

General Purpose Bonding

N

Y

235-275
(113-135)

-65-180
(-54-82)

Enhanced Peel Strength

FR Epoxy

General Purpose Bonding

Y

Y

235-275
(113-135)

-65-180
(-54-82)

Specifically Designed for A/C Components

L-303 (LHR)

FR Epoxy

General Purpose Bonding, A/C Components

Y

Y

235-275
(113-135)

-65-180
(-54-82)

Specifically Designed for A/C Interiors

Phenolic / PVB, Low Tack/Flow

Laminating, Ballistics

N

Y

230-275
(110-135)

-65-180
(-54-82)

Designed for Ballistic Applications

Modified Phenolic, "Bond-Aid"

Honeycomb Sandwich Panels

Y

Y

264-325
(129-163)

-65-180
(-54-82)

Increased FR version Available

Modified Phenolic "Bond-Aid"

Honeycomb Sandwich Panels

Y

Y

264-325
(129-163)

-65-180
(-54-82)

FR Enhanced

Epoxy, Core Splice

Honeycomb Core Splice Filler

Y

N

230-275
(110-135)

-65-180
(-54-82)

Epoxy, H/T

A/C Components, Metallic or Composite

N

Y

275-375
(135-191)

-65-400
(-54-204)

Wide range of cure cycles, HT-Tolerance

Modified Epoxy, High Toughness

General Purpose, A/C Components

N

Y

235-315
(113-157)

-65-250
(-54-121)

FR Version Available

Surfacing Film,
Modified Epoxy

Composite Surfacing,
OOA Assemblies

Y

Y

250-350
(121-177)

-65-300
(-54-149)

Designed to give a tough, paint ready sandable surface directly from mold

Epoxy, Core Splice,
Dual Temp Cure

Honeycomb
Core Splice Filler

Y

N

230-350
(110-177)

-65-250
(-54-121)

Modified Epoxy Film Adhesive

General Purpose
Bonding

N

Y

235-275
(113-135)

-65-180
(-54-82)

Non-Volatiles,
Metal-Metal Bonding

Film Adhesive, Epoxy, L/T Cure

General Purpose, Tooling / Molding

Y

Y

160-250
(71-121)

-65-180
(-54-82)

Low Temperature Cure

Surfacing Film, Modified Phenolic

Composite Surfacing, Phenolic Assemblies

Y

N

260-315
(127-157)

-65-180
(-54-82)