L-991
Low Heat Release Carbon, Phenolic Prepreg
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Product Data Sheet Revised 12/21/06
Description

L-991 is a 260°F (127°C) curing phenolic prepreg with excellent elevated temperature properties. L-991 is available as unidirectional tape or on 3K70P carbon fabric or other styles of fabric as requested. L-991 is intended to be used as a single ply or multiple ply skin for aramid/phenolic honeycomb in aircraft interior honeycomb sandwich panels.

Advantages of L-991
  • When used without an adhesive film, L-991 prepreg facings create sandwich panels with high peel strength and high toughness.
  • Processing of L-991 can be easily adapted to most heated presses, autoclaves or ovens.
  • L-991 is also an excellent laminating prepreg when heat resistance is a requirement.
  • When tested per the FAA required OSU test, L-991 will allow the designer to create structure which will meet or exceed these stringent requirements.
  Physical Properties on 3K70P Style Carbon Fabric
  • Standard Weight: 0.072 lbs/ft2 (352 g/m2)
  • Standard Resin Content: 45% by weight
  • Volatile Content: 9% max
  • Standard Tack: Medium to High
  • Cured Ply Thickness: 0.007” (0.178 mm)
  • Other Weights, Resin Contents, and Fabrics are Available.
 Availability
  • Fabric: Rolls up to 60” width iup to 100 yards long (152 cm x 91 m)
  • Unidirectional Tape: Rolls up to 24" width up to 60 yards long ( 61 cm x 55 m)
Shelf Life
  • 6 months at 40°F (4°C) or below
  • 14 days at room temperature (75°F or 24°C)
Cure Cycles
  • 60 minutes minimum at 260°F (126°C) with full vacuum pressure or higher pressures using press or autoclave. Cool to 170°F (77°C) under pressure .
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NOTICE:Product data and parameters cited in this publication have been obtained in J.D. Lincoln, Inc. laboratories using the materials under carefully controlled conditions. The information, therefore, is believed to be accurate and correctly stated. Data of this type may be considered to be indicative of representative properties obtainable. J.D. Lincoln, Inc. cannot accept responsibility for the misapplication of these products, nor for their use under uncontrolled conditions. Numerical values resulting from the application of this material are dependant on processing details. It is recommended that the user develop his or her own application techniques and generate data consistent with his or her specific application and process.

 
       
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