| |
L-961
Epoxy Carbon Prepreg, Low Energy Cure |
|
|
| Maximum Lay-up Life |
- 18-20 hours at 75°F (24°C)
|
| Curable Work Life |
- 24-36 hours at 75°F (24°C)
|
| Cure Cycles |
- 20 hours at 140°F (60°C), or
- 180 minutes at 175°F (79°C), or
- 30 minutes at 225°F (107°C).
|
| Flammability |
- Self Extinguishing per FAR part 25.853
|
| Mechanical Data |
|
LAMINATE PROPERTIES |
PROPERTY |
T700 Unidirectional |
100 |
TEST METHOD |
ULTIMATE TENSILE STRENGTH |
|
|
|
Room Temperature (RT) |
194 KSI (1.3 GPa) |
90 KSI (621 MPa) |
ASTM D 3039 |
180°F (82°C) |
185 KSI (1.3 GPa) |
72 KSI (497 MPa) |
ASTM D 3039 |
TENSILE MODULUS |
|
|
|
Room Temperature (RT) |
16.2 MSI (112 GPa) |
11.4 MSI (79 GPa) |
ASTM D 3039 |
180°F (82°C) |
15.2 MSI (105 GPa) |
11.7 MSI (81 GPa) |
ASTM D 3039 |
COMPRESSIVE STRENGTH |
|
|
|
Room Temperature (RT) |
144 KSI (993 MPa) |
66 KSI (455 MPa) |
SACMA SRM IR-94 |
180°F (82°C) |
133 KSI (917 MPa) |
59 KSI (407 MPa) |
SACMA SRM IR-94 |
COMPRESSIVE MODULUS |
|
|
|
Room Temperature (RT) |
14.9 MSI (103 GPa) |
10.3 MSI (71 GPa) |
SACMA SRM IR-94 |
180°F (82°C) |
12.8 MSI (88 GPa) |
10.0 MSI (69 GPa) |
SACMA SRM IR-94 |
ULTIMATE FLEXURAL STRENGTH |
|
|
|
Room Temperature (RT) |
118 KSI (814 MPa) |
76 KSI (524 MPa) |
ASTM D 790 |
180°F (82°C) |
109 KSI (752 MPa) |
49 KSI (338 MPa) |
ASTM D 790 |
FLEXURAL MODULUS |
|
|
|
Room Temperature (RT) |
13.4 MSI (92 GPa) |
8.0 MSI (55 GPa) |
ASTM D 790 |
180°F (82°C) |
13.0 MSI (90 GPa) |
6.5 MSI (45 GPa) |
ASTM D 790 |
SHORT BEAM SHEAR STRENGTH |
|
|
|
Room Temperature (RT) |
9.4 KSI (65 MPa) |
6.4 KSI (44 MPa) |
ASTM D 2344 |
180°F (82°C) |
7.6 KSI (52 MPa) |
4.6 KSI (32 MPa) |
ASTM D 2344 |
|
| |
|
|
NOTICE:Product data and parameters cited in this publication have been obtained in J.D. Lincoln, Inc. laboratories using the materials under carefully controlled conditions. The information, therefore, is believed to be accurate and correctly stated. Data of this type may be considered to be indicative of representative properties obtainable. J.D. Lincoln, Inc. cannot accept responsibility for the misapplication of these products, nor for their use under uncontrolled conditions. Numerical values resulting from the application of this material are dependant on processing details. It is recommended that the user develop his or her own application techniques and generate data consistent with his or her specific application and process.
|
|
|
