L-952
Laminating Graphite Prepreg, High Temperature
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Cure Cycles Continued...
  • L-952 may be bonded into various structures using L-313 high temperature adhesive and L-309 corrosion inhibiting primer. 350°F (177°C) flatwise tension values with L-313 adhesive exceed 950 PSI (6.6 MPa) against 1/8” (3.175 mm) cell aluminum core.
  • Typical construction techniques utilize a layer of fiberglass prepreg such as L-552 for dissimilar metal protection against metallic details or metal honeycomb. In addition, a layer of L-552 may be used to provide “softening” of graphite to metal joints where local loads need to be distributed to avoid local metal overload failure.
Mechanical Data

 

LAMINATE PROPERTIES

PROPERTY

85 PSI (0.59 MPa) CURE

VACUUM BAG CURE

TEST METHOD

ULTIMATE TENSILE STRENGTH

 

 

 

Room Temperature (RT)

78 KSI (538 MPa)

71 KSI (490 MPa)

ASTM D638

250°F (121°C)

75 KSI (517 MPa)

67 KSI (462 MPa)

ASTM D638

350°F (177°C)

72 KSI (497 MPa)

-

ASTM D638

TENSILE MODULUS

 

 

 

Room Temperature (RT)

10.1 MSI (70 GPa)

9.9 MSI (68 GPa)

ASTM D638

250°F (121°C)

10.0 MSI (69 GPa)

9.7 MSI (67 GPa)

ASTM D638

350°F (177°C)

9.8 MSI (68 GPa)

-

ASTM D638

ULTIMATE COMPRESSION STRENGTH

 

 

 

Room Temperature (RT)

72 KSI (497 MPa)

67 KSI (462 MPa)

ASTM D695

250°F (121°C)

69 KSI (476 MPa)

 -

ASTM D695

350°F (177°C)

59 KSI (407 MPa)

 -

ASTM D695

COMPRESSION MODULUS

 

 

 

Room Temperature (RT)

9.0 MSI (62 GPa)

8.8 MSI (61 GPa)

ASTM D695

250°F (121°C)

9.0 MSI (62 GPa)

 -

ASTM D695

350°F (177°C)

8.7 MSI (60 GPa)

 -

ASTM D695

ULTIMATE FLEXURAL STRENGTH

 

 

 

Room Temperature (RT)

105 KSI (724 MPa)

97 KSI (669 MPa)

ASTM D790

250°F (121°C)

96 KSI (662 MPa)

 -

ASTM D790

350°F (177°C)

80 KSI (552 MPa)

 -

ASTM D790

FLEXURAL MODULUS

 

 

 

Room Temperature (RT)

9.0 MSI (62 GPa)

8.7 MSI (60 GPa)

ASTM D790

250°F (121°C)

8.4 MSI (58 GPa)

 -

ASTM D790

350°F (177°C)

8.1 MSI (56 GPa)

 -

ASTM D790

 
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NOTICE:Product data and parameters cited in this publication have been obtained in J.D. Lincoln, Inc. laboratories using the materials under carefully controlled conditions. The information, therefore, is believed to be accurate and correctly stated. Data of this type may be considered to be indicative of representative properties obtainable. J.D. Lincoln, Inc. cannot accept responsibility for the misapplication of these products, nor for their use under uncontrolled conditions. Numerical values resulting from the application of this material are dependant on processing details. It is recommended that the user develop his or her own application techniques and generate data consistent with his or her specific application and process.

 
       
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