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L-751
Woven Epoxy Laminating Prepreg, Aramid |
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| Mechanical Data |
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LAMINATE PROPERTIES |
PROPERTY |
30 PSI (0.24 MPa) CURE |
VACUUM BAG CURE |
TEST METHOD |
ULTIMATE TENSILE STRENGTH |
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Room Temperature (RT) |
69 KSI (476 MPa) |
67 KSI (462 MPa) |
ASTM D638 |
160°F (71°C) |
61 KSI (421 MPa) |
59 KSI (407 MPa) |
ASTM D638 |
RT(WET) |
67 KSI (462 MPa) |
64 KSI (441 MPa) |
ASTM D638 |
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TENSILE MODULUS |
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Room Temperature (RT) |
3.9 MSI (27 GPa) |
3.8 MSI (26 GPa) |
ASTM D638 |
160°F (71°C) |
3.4 MSI (23 GPa) |
3.3 MSI (23 GPa) |
ASTM D638 |
RT(WET) |
3.7 MSI (26 GPa) |
3.6 MSI (25 GPa) |
ASTM D638 |
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ULTIMATE COMPRESSION STRENGTH |
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Room Temperature (RT) |
22 KSI (152 MPa) |
21 KSI (145 MPa) |
ASTM D695 |
160°F (71°C) |
16 KSI (110 MPa) |
15 KSI (103 MPa) |
ASTM D695 |
RT(WET) |
21 KSI (145 MPa) |
20 KSI (138 MPa) |
ASTM D695 |
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COMPRESSION MODULUS |
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Room Temperature (RT) |
3.0 MSI (21 GPa) |
2.9 MSI (20 GPa) |
ASTM D695 |
160°F (71°C) |
2.9 MSI (20 GPa) |
2.7 MSI (19 GPa) |
ASTM D695 |
RT(WET) |
2.9 MSI (20 GPa) |
2.7 MSI (19 GPa) |
ASTM D695 |
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ULTIMATE FLEXURAL STRENGTH |
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Room Temperature (RT) |
44 KSI (303 MPa) |
42 KSI (290 MPa) |
ASTM D790 |
160°F (71°C) |
23 KSI (159 MPa) |
21 KSI (145 MPa) |
ASTM D790 |
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FLEXURAL MODULUS |
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Room Temperature (RT) |
3.1 MSI (21 GPa) |
3.0 MSI (21 GPa) |
ASTM D790 |
160°F (71°C) |
3.0 MSI (21 GPa) |
2.9 MSI (20 GPa) |
ASTM D790 |
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INTERLAMINAR SHEAR STRENGTH |
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Room Temperature (RT) |
2.7 KSI (19 MPa) |
2.6 KSI (18 MPa) |
ASTM D2344 |
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NOTICE:Product data and parameters cited in this publication have been obtained in J.D. Lincoln, Inc. laboratories using the materials under carefully controlled conditions. The information, therefore, is believed to be accurate and correctly stated. Data of this type may be considered to be indicative of representative properties obtainable. J.D. Lincoln, Inc. cannot accept responsibility for the misapplication of these products, nor for their use under uncontrolled conditions. Numerical values resulting from the application of this material are dependant on processing details. It is recommended that the user develop his or her own application techniques and generate data consistent with his or her specific application and process.
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