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L-695
Cyanate Ester Prepreg |
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| Applications |
- High-performance electrical applications
- Radomes
- Antennae
- Space Hardware
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| Preferred Cure Cycle |
- Ramp from RT to 250°F (121°C) at 2-5°F/minute (1-3°C) under full vacuum pressure
- Hold at 250°F (121°C) and increase pressure to 85 PSI (0.59 MPa) while venting vacuum bag
- After holding 30 minutes at 250°F (121°C), increase temperature to 350°F (177°C) while under 85 PSI (0.59 MPa) pressure
- Hold at 350°F (177°C) for 2 hours
- Cool under pressure to below 200°F (93°C)
- Post cure free standing at 550°F (288°C) for 1 hour
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| Mechanical Data |
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LAMINATE PROPERTIES |
PROPERTY |
7781 FIBERGLASS |
581 QUARTZ |
TEST METHOD |
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ULTIMATE FLEXURAL STRENGTH |
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RT |
94 KSI (648 MPa) |
86 KSI (593 MPa) |
ASTM D 790 |
350°F (177°C) |
81 KSI (558 MPa) |
69 KSI (476 MPa) |
ASTM D 790 |
500°F (260°C) |
85 KSI (586 MPa) |
62 KSI (427 MPa) |
ASTM D 790 |
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FLEXURAL MODULUS |
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RT |
3.4 MSI (23 GPa) |
4.2 MSI (29 GPa) |
ASTM D 790 |
350°F (177°C) |
3.2 MSI (22 GPa) |
4.3 MSI (30 GPa) |
ASTM D 790 |
500°F (260°C) |
4.7 MSI (32 GPa) |
4.3 MSI (30 GPa) |
ASTM D 790 |
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SHORT BEAM SHEAR STRENGTH |
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RT |
8.1 KSI (56 MPa) |
7.9 KSI (54 MPa) |
ASTM D 2344 |
350°F (177°C) |
7.1 KSI (49 MPa) |
6.2 KSI (43 MPa) |
ASTM D 2344 |
500°F (260°C) |
6.9 KSI (48 MPa) |
5.7 KSI (39 MPa) |
ASTM D 2344 |
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NOTICE:Product data and parameters cited in this publication have been obtained in J.D. Lincoln, Inc. laboratories using the materials under carefully controlled conditions. The information, therefore, is believed to be accurate and correctly stated. Data of this type may be considered to be indicative of representative properties obtainable. J.D. Lincoln, Inc. cannot accept responsibility for the misapplication of these products, nor for their use under uncontrolled conditions. Numerical values resulting from the application of this material are dependant on processing details. It is recommended that the user develop his or her own application techniques and generate data consistent with his or her specific application and process.
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