L-603
Woven Polyimide Prepreg
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 Flammability
  • Self Extinguishing per FAR part 25.853
Typical Autoclave Cure Cycle
  • Apply full vacuum at room temperature (70°F or 21°C) for 1 hour minimum.
  • Apply 30 PSI (0.21 MPa) autoclave pressure plus
  • 180 ± 10°F (82 ± 5°C) for 2 hours, then
  • 200 ± 10°F (93 ± 5°C) for 2 hours, then
  • Increase temperature 1-2°F (1°C) per minute to 350 ± 10°F (177 ± 5°C), then
  • 350°F ± 10°F (177 ± 5°C) for 2 hours
  • Cool under pressure to 150°F (66°C) maximum
  • Post Cure: 550 ± 10°F (288 ± 5°C) for 120-150 minutes or per specification requirements
Variations
  • The L-603 resin system can be supplied on the surface of polyimide film to create a vapor and/or dielectric barrier.
  • The L-603 resin system can be supplied on thin fiberglass scrim fabrics for use in aircraft insulation blankets and other high-temperature bonding applications.
Mechanical Properties

 

LAMINATE PROPERTIES

PROPERTY

30 PSI (0.20 MPa) CURE

METHOD

 

WITH POSTCURE

 

ULTIMATE TENSILE STRENGTH

 

 

Warp-RT

47,000 PSI (324 MPa)

ASTM D638, Type 1

Fill-RT

42,000 PSI (290 MPa)

ASTM D638, Type 1

ULTIMATE FLEXURAL STRENGTH

 

 

Warp-RT

78,000 PSI (538 MPa)

ASTM D790

Fill-RT

69,000 PSI (476 MPa)

ASTM D790

FLEXURAL MODULUS

 

 

Warp-RT

2.6 MSI (18 GPa)

ASTM D790

Fill-RT

2.6 MSI (18 GPa)

ASTM D790

SHORT BEAM SHEAR STRENGTH

 

 

Warp-RT

6,670 PSI (46 MPa)

ASTM D2344

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NOTICE:Product data and parameters cited in this publication have been obtained in J.D. Lincoln, Inc. laboratories using the materials under carefully controlled conditions. The information, therefore, is believed to be accurate and correctly stated. Data of this type may be considered to be indicative of representative properties obtainable. J.D. Lincoln, Inc. cannot accept responsibility for the misapplication of these products, nor for their use under uncontrolled conditions. Numerical values resulting from the application of this material are dependant on processing details. It is recommended that the user develop his or her own application techniques and generate data consistent with his or her specific application and process.

 
       
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