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L-591
Low Heat Release Phenolic Prepreg |
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| Flammability |
- Self Extinguishing per FAR part 25.853
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| Sandwich Properties* |
Core: 1/8” cell Aramid Phenolic honeycomb; Adhesive: none
Facings: 2 plies L-591-7781 each side
- RT Flatwise Tensile Strength: 140 PSI (0.965 MPa)
- RT Sandwich Peel Strength: 6 in lb/in (27 N/25 mm)
- *Sandwich peel strength varies with the orientation of fibers directly against the core and test direction.
- Fibers laid up parallel with the test direction produce minimum strengths.
- Fibers laid up perpendicular to the test direction produce maximum strengths.
- L-591-7781 sandwich peel strength ranges from 4-8 in lb/in (18-36 N/25 mm).
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| Mechanical Properties |
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LAMINATE PROPERTIES |
PROPERTY |
50 PSI (0.344 MPa) CURE |
TEST METHOD |
ULTIMATE TENSILE STRENGTH |
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Room Temperature |
56,000 PSI (386 MPa) |
ASTM D638 |
160°F (71°C) |
51,000 PSI (352 MPa) |
ASTM D638 |
TENSILE MODULUS |
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Room Temperature |
3.5 MSI (24.1 GPa) |
ASTM D638 |
160°F (71°C) |
3.5 MSI (24.1 GPa) |
ASTM D638 |
ULTIMATE COMPRESSION STRENGTH |
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Room Temperature |
55,000 PSI (379 MPa) |
ASTM D695 |
160°F (71°C) |
54,000 PSI (372 MPa) |
ASTM D695 |
COMPRESSION MODULUS |
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Room Temperature |
3.5 MSI (24.1 GPa) |
ASTM D695 |
160°F (71°C) |
3.5 MSI (24.1 GPa) |
ASTM D695 |
ULTIMATE FLEXURAL STRENGTH |
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Room Temperature |
65,000 PSI (448 MPa) |
ASTM D790 |
160°F (71°C) |
61,000 PSI (419 MPa) |
ASTM D790 |
FLEXURAL MODULUS |
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Room Temperature |
3.5 MSI (24.1 GPa) |
ASTM D790 |
160°F (71°C) |
3.3 MSI (22.7 GPa) |
ASTM D790 |
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SANDWICH PROPERTIES |
PROPERTY |
VACUUM BAG CURE |
TEST METHOD |
FLATWISE TENSILE |
233 PSI (1.6 MPa) |
ASTM C297 |
LONG BEAM FLEXURAL STRENGTH |
16,500 PSI (114 MPa) |
ASTM C393 |
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NOTICE:Product data and parameters cited in this publication have been obtained in J.D. Lincoln, Inc. laboratories using the materials under carefully controlled conditions. The information, therefore, is believed to be accurate and correctly stated. Data of this type may be considered to be indicative of representative properties obtainable. J.D. Lincoln, Inc. cannot accept responsibility for the misapplication of these products, nor for their use under uncontrolled conditions. Numerical values resulting from the application of this material are dependant on processing details. It is recommended that the user develop his or her own application techniques and generate data consistent with his or her specific application and process.
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