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L-575TG
Solution Coated Woven Prepreg , Low Energy Cure |
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| Mechanical Data |
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LAMINATE PROPERTIES |
PROPERTY |
25 PSI (0.172 MPa) CURE |
VACUUM BAG CURE |
TEST METHOD |
ULTIMATE TENSILE STRENGTH |
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Room Temperature |
60,000 PSI (414 MPa) |
55,000 PSI (379 MPa) |
ASTM D638 |
160°F (71°C) |
50,000 PSI (345 MPa) |
45,000 PSI (310 MPa) |
ASTM D638 |
Room Temperature (WET) |
53,000 PSI (366 MPa) |
50,000 PSI (345 MPa) |
ASTM D638 |
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TENSILE MODULUS |
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Room Temperature |
3.7 MSI (25.5 GPa) |
3.6 MSI (24.8 GPa) |
ASTM D638 |
160°F (71°C) |
3.5 MSI (24.1 GPa) |
3.4 MSI (23.4 GPa) |
ASTM D638 |
Room Temperature (WET) |
3.5 MSI (24.1 GPa) |
3.3 MSI (22.7 GPa) |
ASTM D638 |
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ULTIMATE COMPRESSIVE STRENGTH |
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Room Temperature |
62,000 PSI (428 MPa) |
58,000 PSI (400 MPa) |
ASTM D695 |
160°F (71°C) |
50,000 PSI (345 MPa) |
42,000 PSI (290 MPa) |
ASTM D695 |
Room Temperature (WET) |
54,000 PSI (372 MPa) |
50,000 PSI (345 MPa) |
ASTM D695 |
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COMPRESSIVE MODULUS |
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Room Temperature |
3.7 MSI (25.5 GPa) |
3.6 MSI (24.8 GPa) |
ASTM D695 |
160°F (71°C) |
3.6 MSI (24.8 GPa) |
3.5 MSI (24.1 GPa) |
ASTM D695 |
Room Temperature (WET) |
3.6 MSI (24.8 GPa) |
3.5 MSI (24.1 GPa) |
ASTM D695 |
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ULTIMATE FLEXURAL STRENGTH |
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Room Temperature |
88,000 PSI (607 GPa) |
80,000 PSI (551 MPa) |
ASTM D790 |
160°F (71°C) |
60,000 PSI (414 GPa) |
54,000 PSI (372 MPa) |
ASTM D790 |
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FLEXURAL MODULUS |
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Room Temperature |
3.5 MSI (24.1 GPa) |
3.4 MSI (23.4 GPa) |
ASTM D790 |
160°F (71°C) |
3.2 MSI (22.1 GPa) |
3.2 MSI (22.1 GPa) |
ASTM D790 |
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INTERLAMINAR SHEAR |
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Room Temperature (RT) |
6,200 PSI (42.8 MPa) |
5,400 PSI (37.2 MPa) |
ASTM D2344 |
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NOTICE:Product data and parameters cited in this publication have been obtained in J.D. Lincoln, Inc. laboratories using the materials under carefully controlled conditions. The information, therefore, is believed to be accurate and correctly stated. Data of this type may be considered to be indicative of representative properties obtainable. J.D. Lincoln, Inc. cannot accept responsibility for the misapplication of these products, nor for their use under uncontrolled conditions. Numerical values resulting from the application of this material are dependant on processing details. It is recommended that the user develop his or her own application techniques and generate data consistent with his or her specific application and process.
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