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L-556
Solution Coated Epoxy Prepreg, Heat Resistant |
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| Cure Cycles |
- 90 minutes at 350°F (177°C), or
- 120 minutes at 300°F (149°C), or
- 180 minutes at 275°F (135°C), or
- 240 minutes at 235°F (113°C).
- Typical Cycle: RT to 265 +0/-10°F (129 +0/-6°C) in 20-30 minutes, hold at 265 +0/-10°F (129 +0/-6°C) for 20-25 minutes, raise to 350 +0/-10°F (177 +0/-6°C) in 20-30 minutes, hold at 350 +0/-10°F (177 +0/-6°C) for 120 ± 10 minutes. This cure is in an autoclave, blanket press, or platen press at 45-85 PSI (0.31-0.59 MPa).
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| Mechanical Data |
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LAMINATE PROPERTIES |
PROPERTY |
VACUUM BAG CURE |
40 PSI (0.28 MPa) CURE |
TEST METHOD |
ULTIMATE TENSILE STRENGTH |
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Room Temperature (RT) |
61 KSI (421 MPa) |
63 KSI (434 MPa) |
ASTM D638 |
350°F (177°C) |
48 KSI (331 MPa) |
50 KSI (345 MPa) |
ASTM D638 |
TENSILE MODULUS |
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Room Temperature (RT) |
3.0 MSI (21 GPa) |
3.2 MSI (22 GPa) |
ASTM D638 |
COMPRESSIVE STRENGTH |
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Room Temperature (RT) |
83 KSI (572 MPa) |
65 KSI (448 MPa) |
ASTM D695 |
350°F (177°C) |
40 KSI (276 MPa) |
53 KSI (366 MPa) |
ASTM D695 |
COMPRESSIVE MODULUS |
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Room Temperature (RT) |
-- |
4.4 MSI (30 GPa) |
ASTM D695 |
350°F (177°C) |
-- |
3.6 MSI (25 GPa) |
ASTM D695 |
ULTIMATE FLEXURAL STRENGTH |
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Room Temperature (RT) |
102 KSI (703 MPa) |
103 KSI (710 MPa) |
ASTM D790 |
350°F (177°C) |
68 KSI (469 MPa) |
82 KSI (566 MPa) |
ASTM D790 |
420°F (216°C) |
55 KSI (379 MPa) |
59 KSI (407 MPa) |
ASTM D790 |
500°F (260°C) |
-- |
25 KSI (172 MPa) |
ASTM D790 |
FLEXURAL MODULUS |
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Room Temperature (RT) |
3.4 MSI (23 GPa) |
3.5 MSI (24 GPa) |
ASTM D790 |
350°F (177°C) |
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3.4 MSI (23 GPa) |
ASTM D790 |
CAUTION: Do not build any section of L-556 over 0.250” (6.35 mm) thick. Please contact the J.D. Lincoln, Inc. company for special curing requirements for parts thicker than 0.250” (6.35 mm). |
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NOTICE:Product data and parameters cited in this publication have been obtained in J.D. Lincoln, Inc. laboratories using the materials under carefully controlled conditions. The information, therefore, is believed to be accurate and correctly stated. Data of this type may be considered to be indicative of representative properties obtainable. J.D. Lincoln, Inc. cannot accept responsibility for the misapplication of these products, nor for their use under uncontrolled conditions. Numerical values resulting from the application of this material are dependant on processing details. It is recommended that the user develop his or her own application techniques and generate data consistent with his or her specific application and process.
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