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L-552
Laminating Prepreg, High Temperature |
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To enhance the high temperature properties, a post cure may be used. Post cure cycle:
- 2 hours at 300°F (149°C) followed by 2 hours at 400°F (204°C)
L-552 may be bonded into various structures using L-313 high temperature adhesive and L-313 adhesive primer. 350°F (177°C) flatwise tension values against 1/8” (3.175 mm) cell aluminum honeycomb exceed 950 PSI (6.6 MPa) using the L-313 adhesive for the L-552 facesheet to core bond. |
| Mechanical Data |
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LAMINATE PROPERTIES |
PROPERTY |
35 PSI (0.24 MPa) CURE |
VACUUM BAG CURE |
TEST METHOD |
ULTIMATE TENSILE STRENGTH |
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Room Temperature (RT) |
65 KSI (448 MPa) |
61 KSI (421 MPa) |
ASTM D638 |
250°F (121°C) |
61 KSI (421 MPa) |
54 KSI (372 MPa) |
ASTM D638 |
350°F 177°C) |
59 KSI (407 MPa) |
50 KSI (345 MPa) |
ASTM D638 |
TENSILE MODULUS |
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Room Temperature (RT) |
4.1 MSI (28 GPa) |
3.9 MSI (27 GPa) |
ASTM D638 |
250°F (121°C) |
3.9 MSI (27 GPa) |
3.6 MSI (25 GPa) |
ASTM D638 |
350°F 177°C) |
3.5 MSI (24 GPa) |
3.4 MSI (23 GPa) |
ASTM D638 |
COMPRESSIVE STRENGTH |
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Room Temperature (RT) |
68 KSI (469 MPa) |
62 KSI (428 MPa) |
ASTM D695 |
250°F (121°C) |
50 KSI (345 MPa) |
47 KSI (324 MPa) |
ASTM D695 |
350°F 177°C) |
44 KSI (303 MPa) |
40 KSI (276 MPa) |
ASTM D695 |
COMPRESSIVE MODULUS |
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Room Temperature (RT) |
4.2 MSI (29 GPa) |
4.0 MSI (28 GPa) |
ASTM D695 |
250°F (121°C) |
4.0 MSI (28 GPa) |
3.8 MSI (26 GPa) |
ASTM D695 |
350°F 177°C) |
3.7 MSI (26 GPa) |
3.6 MSI (25 GPa) |
ASTM D695 |
ULTIMATE FLEXURAL STRENGTH |
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Room Temperature (RT) |
92 KSI (634 MPa) |
88 KSI (607 MPa) |
ASTM D790 |
250°F (121°C) |
76 KSI (524 MPa) |
73 KSI (503 MPa) |
ASTM D790 |
350°F 177°C) |
63 KSI (434 MPa) |
60 KSI (414 MPa) |
ASTM D790 |
FLEXURAL MODULUS |
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Room Temperature (RT) |
4.1 MSI (28 GPa) |
3.9 MSI (27 GPa) |
ASTM D790 |
250°F (121°C) |
4.0 MSI (28 GPa) |
3.7 MSI (26 GPa) |
ASTM D790 |
350°F 177°C) |
3.2 MSI (22 GPa) |
3.2 MSI (22 GPa) |
ASTM D790 |
CAUTION: Do not build any section of L-552 over 0.250” (6.35 mm) thick. Please contact the J.D. Lincoln, Inc. company for special curing requirements for parts thicker than 0.250” (6.35 mm). |
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NOTICE:Product data and parameters cited in this publication have been obtained in J.D. Lincoln, Inc. laboratories using the materials under carefully controlled conditions. The information, therefore, is believed to be accurate and correctly stated. Data of this type may be considered to be indicative of representative properties obtainable. J.D. Lincoln, Inc. cannot accept responsibility for the misapplication of these products, nor for their use under uncontrolled conditions. Numerical values resulting from the application of this material are dependant on processing details. It is recommended that the user develop his or her own application techniques and generate data consistent with his or her specific application and process.
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