L-362
Modified Epoxy Film Adhesive, Dual Temperature Cure
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  Adhesive Primers
L-362 is designed to be used with:
  • L-319-1 Corrosion Inhibiting Adhesive Primer
Applicable Documents
  • MMM-A-132
  • MIL-A-25463
  Mechanical Properties: 0.060 lbs/ft2 (292 g/m2) Adhesive Film

PROPERTY

250°F (121°C) CURE

350°F (176°C) CURE

TEST METHOD

 

 

 

 

SINGLE OVERLAP SHEAR STRENGTH

 

 

 

-67°F (-55°C)

5,770 PSI (39.7 MPa)

5,820 PSI (40.1 MPa)

ASTM D1002

Room Temp

5,750 PSI (39.6 MPa)

5,600 PSI (38.6 MPa)

ASTM D1002

180°F (82°C)

4,450 PSI (30.7 MPa)

4,570 PSI (31.5 MPa)

ASTM D1002

 

 

 

ASTM D1002

 

 

 

 

FLATWISE TENSILE STRENGTH

 

 

 

-67°F (-55°C)

880 PSI (6.1 MPa)

840 PSI (5.8 MPa)

ASTM C297

Room Temp

820 PSI (5.7 MPa)

810 PSI (5.6 MPa)

ASTM C297

180°F (82°C)

510 PSI (3.5 MPa)

480 PSI (3.3 MPa)

ASTM C297

 

 

 

 

CLIMBING DRUM PEEL STRENGTH

 

 

 

-67°F (-55°C)

14 in lb/in (62 N/25 mm)

14 in lb/in (62 N/25 mm)

ASTM D1781

Room Temp

11 in lb/in (49 N/25 mm

10 in lb/in (45 N/25 mm)

ASTM D1781

180°F (82°C)

7 in lb/in (31 N/25 mm)

6 in lb/in (27 N/25 mm)

ASTM D1781

 

 

 

 

KGR-1 THICK ADHEREND

 

 

 

-67°F (-55°C)

6,570 PSI (45.3 MPa)

6,880 PSI (47.4 MPa)

ASTM D5656

Room Temp

8,300 PSI (57.2 MPa)

7,970 PSI (54.9 MPa)

ASTM D5656

180°F (82°C)

4,410 PSI (30.4 MPa)

4,370 PSI (30.1 MPa)

ASTM D5656

  

NOTICE:Product data and parameters cited in this publication have been obtained in J.D. Lincoln, Inc. laboratories using the materials under carefully controlled conditions. The information, therefore, is believed to be accurate and correctly stated. Data of this type may be considered to be indicative of representative properties obtainable. J.D. Lincoln, Inc. cannot accept responsibility for the misapplication of these products, nor for their use under uncontrolled conditions. Numerical values resulting from the application of this material are dependant on processing details. It is recommended that the user develop his or her own application techniques and generate data consistent with his or her specific application and process.

 
       
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