L-362
Modified Epoxy Film Adhesive, Dual Temperature Cure
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Product Data Sheet Revised 12/20/06
Description

L-362 is a dual-cure, toughened epoxy adhesive film with heat resistance suitable for a wide variety of applications. Metallic or non-metallic substrates may be bonded with L-362 to provide a tough, durable, structural joint with excellent resistance to temperatures up to 250°F (121°C). Facings may be bonded to aluminum or aramid/phenolic honeycomb.

Advantages of L-362
  • Film weights as low as 0.005 lbs/ft2 (24 g/m2) can be manufactured for ultra lightweight designs such as space components or electronic applications.
  • L-362 will co-cure with many of today’s modern epoxy matrix composites.
  • L-362 may be reticulated by the user to minimize the total weight of a sandwich structure.
  • Room temperature outlife exceeds 7 days at 75°F (24°C) or below.
  • L-362 can be cured at both 250°F and 350°F (121°C and 176°C).
  Physical Properties
  • Standard Weight: 0.030 lbs/ft2 (146 g/m2)
  • Optional Weights: 0.015 lbs/ft2, 0.045 lbs/ft2, 0.060 lbs/ft2 (other weights are available)
  • Standard Thickness: 0.011” (0.279 mm) Nominal
  • Volatile Content: Less than 1.5%
  • Tack: Medium to High Tack
  Shelf Life
  • 6 months at 0°F (-18°C)
  • 7 days at Room Temperature (75°F or 24°C)
 Cure Cycles
  • 120 minutes at 225°F (107°C), or
  • 60 minutes at 250°F (121°C), or
  • 60 minutes at 275°F (135°C), or
  • 60 minutes at 350°F (176°C).

NOTICE:Product data and parameters cited in this publication have been obtained in J.D. Lincoln, Inc. laboratories using the materials under carefully controlled conditions. The information, therefore, is believed to be accurate and correctly stated. Data of this type may be considered to be indicative of representative properties obtainable. J.D. Lincoln, Inc. cannot accept responsibility for the misapplication of these products, nor for their use under uncontrolled conditions. Numerical values resulting from the application of this material are dependant on processing details. It is recommended that the user develop his or her own application techniques and generate data consistent with his or her specific application and process.

 
       
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