L-314
Modified Epoxy Film Adhesive, High Toughness
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Product Data Sheet Revised 12/20/06
Description
L-314 is a toughened, modified epoxy adhesive film with heat resistance suitable for a wide variety of applications. Metallic or non-metallic substrates may be bonded with L-314 to provide a tough, durable, structural joint with excellent resistance to temperatures up to 250°F (121°C). Facings may be bonded to aluminum or aramid / phenolic honeycomb core. L-314 may be cured over a broad range of time, temperature, and pressure cycles to match the requirements of the manufacturer’s process or curing equipment.
Advantages of L-314
  • Film weights as low as 0.005 lbs/ft2 (24 g/m2) can be manufactured for ultra lightweight designs such as aerospace components or electronics components.
  • L-314 will co-cure well with many of today’s modern epoxy matrix composites.
  • L-314 may be reticulated by the user to minimize the total weight of a sandwich structure.
  • Room temperature outlife exceeds 7 days at 75°F (24°C) or below.
  Physical Properties
  • Standard Weight: 0.030 lbs/ft2 (146 g/m2)
  • Optional Weights: 0.005 lbs/ft2, 0.0045 lbs/ft2, 0.060 lbs/ft2 (other weights are available)
  • Standard Thickness: 0.011” (0.279 mm) Nominal
  • Volatile Content: Less than 2.0%
  • Tack: Light Tack
  Availability
  • 36” Rolls x 80 Yards Long (91 cm x 73 m)
  • 50” Wide Rolls x 80 Yards Long (127 cm x 70 m)

NOTICE:Product data and parameters cited in this publication have been obtained in J.D. Lincoln, Inc. laboratories using the materials under carefully controlled conditions. The information, therefore, is believed to be accurate and correctly stated. Data of this type may be considered to be indicative of representative properties obtainable. J.D. Lincoln, Inc. cannot accept responsibility for the misapplication of these products, nor for their use under uncontrolled conditions. Numerical values resulting from the application of this material are dependant on processing details. It is recommended that the user develop his or her own application techniques and generate data consistent with his or her specific application and process.

 
       
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