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L-313
Epoxy Film Adhesive, High Temperature Resistant |
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| Product Data Sheet |
Revised 12/20/06 |
| Description |
| L-313 is an intermediate cure temperature modified epoxy film adhesive suitable for a wide variety of aerospace structural bonding. Typical applications include metals such as 2024-T81 or 6AL-4UV annealed and non-metallics such as pre-cured graphite epoxy laminates, pre-cured fiberglass-epoxy laminates, and various honeycomb core materials including aluminum fiberglass and Aramid phenolic. L-313 provides excellent bond strength over a wide range of processing cycles with high temperature performance up to 400°F (204°C). |
| Advantages of L-313 |
- Cure cycles as low as 295°F (146°C), varying heat-up rates, vacuum or positive pressure may be used without a significant reduction in bond joint strength.
- Low volatile content makes L-313 ideally suited for large area sandwich or metal to metal bond applications.
- L-313 exhibits excellent environmental resistance to salt spray, high humidity, and standard test fluids.
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| Physical Properties |
- Standard Weight: 0.150 lbs/ft2 (732 g/m2)
- Optional Weights: 0.075 lbs/ft2, 0.090 lbs/ft2, 0.120 lbs/ft2 (other weights are available)
- Standard Thickness: 0.018-0.020“ (0.46-0.51 mm)
- Volatile Content: Less than 0.5%
- Tack: Medium
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| Availability |
- 48” Wide Rolls x 40 Yards Long (127 cm x 37 m)
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NOTICE:Product data and parameters cited in this publication have been obtained in J.D. Lincoln, Inc. laboratories using the materials under carefully controlled conditions. The information, therefore, is believed to be accurate and correctly stated. Data of this type may be considered to be indicative of representative properties obtainable. J.D. Lincoln, Inc. cannot accept responsibility for the misapplication of these products, nor for their use under uncontrolled conditions. Numerical values resulting from the application of this material are dependant on processing details. It is recommended that the user develop his or her own application techniques and generate data consistent with his or her specific application and process.
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